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Pridružen/-a: 27.09. 2016, 06:54
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 Objavljeno: 11 Apr 2017 09:59 Naslov sporočila: Road sealant, with what functions and features |
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In the potting of electronic components, commonly used in potting, there are three, namely: polyurethane potting materials, silicone potting material and epoxy potting materials, plastic has its own more than three advantages and disadvantages, so the scope is not the same, as follows:Pavement Repair Equipments - Road Machinery Equipment Manufacturers
Polyurethane potting material advantages: excellent resistance to low temperature, you can use a catalyst to accelerate the curing and does not affect its performance, it is possible to control heart colloid curing time.
Disadvantages: poor temperature capability and easy blistering, after curing the colloid surface is not smooth and poor toughness, resistance to aging and ultraviolet rays are weak earthquake, colloid easy to change color. Application: suitable for the potting of indoor heat is not high electrical components. Epoxy potting material advantage: with excellent high temperature properties and electrical insulation capacity, simple operation, and after curing are very stable, a variety of metal substrates and has excellent adhesion to porous substrates. Disadvantages: weak resistance to thermal changes, prone to crack after being subjected to thermal shock, causing water vapor to penetrate through the cracks in the electronic components, moisture is poor. After curing and high hardness and brittle colloid, easy to strain electronic components. Application: suitable for potting under normal temperature conditions and the environment on the mechanical properties of no special requirements for electronic components.
Silicone potting material
Advantages: 1, anti-aging ability, good weather resistance, excellent impact resistance.
2, has excellent resistance to thermal change capacity, can be used in a wide operating temperature range, to maintain flexibility in the temperature range of -60 �� ~ 200 ��, no cracking.
3, has excellent electrical insulation properties and the ability to effectively improve after potting insulation between the internal components and wiring, and improve the stability of electronic components.
4, no corrosion of electronic components and the curing reaction does not produce any by-products.
5, with excellent repair capabilities, fast and convenient to remove the seal after the repair and replacement of components.
6, has excellent thermal conductivity and flame resistance, effectively improve the heat dissipation capability and the safety factor of electronic components.
7, low viscosity, good flowability, can penetrate into the fine voids and the following components.
8, can be cured at room temperature can also be heat cured, self-discharge bulbs is good, more convenient to use.
9, curing shrinkage is small, has excellent water resistance and seismic capacity Disadvantages: high prices, poor adhesion. Application: suitable for all kinds of potting work in harsh environment electronic components.
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